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"Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite ..."

Cheong-Ha Jung, Won Seo, Gu-sung Kim (2019)

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DOI: 10.1109/3DIC48104.2019.9058848

access: closed

type: Conference or Workshop Paper

metadata version: 2020-04-19

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Cheong-Ha Jung, Won Seo, Gu-sung Kim:
Thermal Stress Tracking in Multi-Die 3D Stacking Structure by Finite Element Analysis. 3DIC 2019: 1-2

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