"Investigation of the Underfill with Negative-Thermal-Expansion Material to ..."

Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka (2019)

> Home

Details and statistics

DOI: 10.1109/3DIC48104.2019.9058838

access: closed

type: Conference or Workshop Paper

metadata version: 2024-08-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/KinoFT19
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/KinoFT19
Hisashi Kino, Takafumi Fukushima, Tetsu Tanaka:
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. 3DIC 2019: 1-4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.