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"Thermal stress analysis of die stacks with fine-pitch IMC interconnections ..."

Sayuri Kohara et al. (2011)

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DOI: 10.1109/3DIC.2012.6263002

access: closed

type: Conference or Workshop Paper

metadata version: 2019-10-19

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  dblp key:
  - conf/3dic/KoharaHSMYOSKK11
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  - https://dblp.org/rec/conf/3dic/KoharaHSMYOSKK11
Sayuri Kohara, Akihiro Horibe, Kuniaki Sueoka, Keiji Matsumoto, Fumiaki Yamada, Yasumitsu Orii, Katsuyuki Sakuma, Takahiro Kinoshita, Takashi Kawakami:
Thermal stress analysis of die stacks with fine-pitch IMC interconnections for 3D integration. 3DIC 2011: 1-7

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