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"Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films ..."
Taro Matsudaira et al. (2019)
- Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu:
Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application. 3DIC 2019: 1-4
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