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ORCID"10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack."
Yuki Ohara et al. (2009)
- Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma
, Kang Wook Lee, Mariappan Murugesan, Jichoel Bea, Fumiaki Yamada, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi:
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6
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