"Comparative study of 3D stacked IC and 3D interposer integration: ..."

Joeri De Vos et al. (2014)

> Home

Details and statistics

DOI: 10.1109/3DIC.2014.7152146

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/3dic/VosCDWSDPB14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/3dic/VosCDWSDPB14
Joeri De Vos, Vladimir Cherman, Mikael Detalle, Teng Wang, Abdellah Salahouelhadj, Robert Daily, Geert Van der Plas, Eric Beyne:
Comparative study of 3D stacked IC and 3D interposer integration: Processing and assembly challenges. 3DIC 2014: 1-7

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.