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"A review of wafer bonding materials and characterizations to enable wafer ..."

G. Williams et al. (2009)

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DOI: 10.1109/3DIC.2009.5306571

access: closed

type: Conference or Workshop Paper

metadata version: 2020-05-11

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G. Williams, Patrick O'Hara, J. Moore, Bart Gordon, J. Rose:
A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing. 3DIC 2009: 1

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