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"MPA: Model-assisted PCB attestation via board-level RO and temperature ..."

Zimu Guo et al. (2017)

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DOI: 10.1109/ASIANHOST.2017.8353990

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-24

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  persistent URL:
  - https://dblp.org/rec/conf/asianhost/GuoXTF17
Zimu Guo, Xiaolin Xu, Mark M. Tehranipoor, Domenic Forte:
MPA: Model-assisted PCB attestation via board-level RO and temperature compensation. AsianHOST 2017: 25-30

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