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"Micro-bump assignment for 3D ICs using order relation."

Ta-Yu Kuan, Yi-Chun Chang, Tai-Chen Chen (2012)

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DOI: 10.1109/ASPDAC.2012.6164970

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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  - conf/aspdac/KuanCC12
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Ta-Yu Kuan, Yi-Chun Chang, Tai-Chen Chen:
Micro-bump assignment for 3D ICs using order relation. ASP-DAC 2012: 341-346

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