"Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers."

Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow (2017)

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DOI: 10.1109/ASPDAC.2017.7858351

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow:
Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers. ASP-DAC 2017: 372-377

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