"A Test Integration Methodology for 3D Integrated Circuits."

Che-Wei Chou et al. (2010)

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DOI: 10.1109/ATS.2010.71

access: closed

type: Conference or Workshop Paper

metadata version: 2023-10-17

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Che-Wei Chou, Jin-Fu Li, Ji-Jan Chen, Ding-Ming Kwai, Yung-Fa Chou, Cheng-Wen Wu:
A Test Integration Methodology for 3D Integrated Circuits. Asian Test Symposium 2010: 377-382

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