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"Three dimensional silicon integration using fine pitch interconnection, ..."

John U. Knickerbocker et al. (2005)

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DOI: 10.1109/CICC.2005.1568756

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes:
Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. CICC 2005: 659-662

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