"Multi-die Integration Using Advanced Packaging Technologies."

Hyung-Jin Lee et al. (2020)

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DOI: 10.1109/CICC48029.2020.9075901

access: closed

type: Conference or Workshop Paper

metadata version: 2024-02-05

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Hyung-Jin Lee, Ravi Mahajan, Farhana Sheikh, Ramune Nagisetty, Manish Deo:
Multi-die Integration Using Advanced Packaging Technologies. CICC 2020: 1-7

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