"A new IC interconnection scheme and design architecture for high ..."

M. S. Lin et al. (2003)

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DOI: 10.1109/CICC.2003.1249454

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type: Conference or Workshop Paper

metadata version: 2021-11-15

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M. S. Lin, Ling Chen, J. Y. Lee, H. T. Liu, C. K. Chou, K. H. Wan, H. M. Chen, Kevin Chou, Roger Hsiao, Eric Lin:
A new IC interconnection scheme and design architecture for high performance ICs at very low fabrication cost - post passivation interconnection. CICC 2003: 533-536

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