BibTeX record conf/cicc/PlasTLKLMSOVMCDNADTBM10

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@inproceedings{DBLP:conf/cicc/PlasTLKLMSOVMCDNADTBM10,
  author    = {Geert Van der Plas and
               Steven Thijs and
               Dimitri Linten and
               Guruprasad Katti and
               Paresh Limaye and
               Abdelkarim Mercha and
               Michele Stucchi and
               Herman Oprins and
               Bart Vandevelde and
               Nikolaos Minas and
               Miro Cupac and
               Morin Dehan and
               Marc Nelis and
               Rahul Agarwal and
               Wim Dehaene and
               Youssef Travaly and
               Eric Beyne and
               Paul Marchal},
  editor    = {Jacqueline Snyder and
               Rakesh Patel and
               Tom Andre},
  title     = {Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack
               - Challenges and solutions},
  booktitle = {{IEEE} Custom Integrated Circuits Conference, {CICC} 2010, San Jose,
               California, USA, 19-22 September, 2010, Proceedings},
  pages     = {1--4},
  publisher = {{IEEE}},
  year      = {2010},
  url       = {https://doi.org/10.1109/CICC.2010.5617425},
  doi       = {10.1109/CICC.2010.5617425},
  timestamp = {Wed, 16 Oct 2019 14:14:52 +0200},
  biburl    = {https://dblp.org/rec/conf/cicc/PlasTLKLMSOVMCDNADTBM10.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}