"Die Stacking Technology for Terabit Chip-to-Chip Communications."

Arifur Rahman et al. (2006)

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DOI: 10.1109/CICC.2006.320826

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-17

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Arifur Rahman, John Trezza, Bernard J. New, Stephen Trimberger:
Die Stacking Technology for Terabit Chip-to-Chip Communications. CICC 2006: 587-590

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