"Research on TSV Void Defects Based on Machine Learning."

Shouhong Chen et al. (2019)

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DOI: 10.1145/3331453.3360965

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-07

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Shouhong Chen, Huaiqiang Kang, Jun Ma, Ling Guo, Xingna Hou:
Research on TSV Void Defects Based on Machine Learning. CSAE 2019: 75:1-75:4

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