"Interconnects in the Third Dimension: Design Challenges for 3D ICs."

Kerry Bernstein et al. (2007)

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DOI: 10.1145/1278480.1278623

access: closed

type: Conference or Workshop Paper

metadata version: 2021-09-19

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Kerry Bernstein, Paul S. Andry, Jerome Cann, Philip G. Emma, David Greenberg, Wilfried Haensch, Mike Ignatowski, Steven J. Koester, John Magerlein, Ruchir Puri, Albert M. Young:
Interconnects in the Third Dimension: Design Challenges for 3D ICs. DAC 2007: 562-567

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