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"On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles ..."
Moongon Jung et al. (2014)
- Moongon Jung, Taigon Song, Yang Wan, Yarui Peng
, Sung Kyu Lim
:
On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective. DAC 2014: 4:1-4:6
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