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"Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling ..."
Jinwoo Kim et al. (2019)
- Jinwoo Kim, Gauthaman Murali
, Heechun Park, Eric Qin, Hyoukjun Kwon
, Venkata Chaitanya Krishna Chekuri
, Nihar Dasari, Arvind Singh, Minah Lee
, Hakki Mert Torun, Kallol Roy, Madhavan Swaminathan, Saibal Mukhopadhyay, Tushar Krishna, Sung Kyu Lim
:
Architecture, Chip, and Package Co-design Flow for 2.5D IC Design Enabling Heterogeneous IP Reuse. DAC 2019: 178
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