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"Is TSV-based 3D integration suitable for inter-die memory repair?"
Mihai Lefter et al. (2013)
- Mihai Lefter, George Razvan Voicu, Mottaqiallah Taouil, Marius Enachescu
, Said Hamdioui, Sorin Dan Cotofana:
Is TSV-based 3D integration suitable for inter-die memory repair? DATE 2013: 1251-1254
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