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"Is TSV-based 3D integration suitable for inter-die memory repair?"

Mihai Lefter et al. (2013)

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DOI: 10.7873/DATE.2013.259

access: closed

type: Conference or Workshop Paper

metadata version: 2021-04-09

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  dblp key:
  - conf/date/LefterVTEHC13
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  persistent URL:
  - https://dblp.org/rec/conf/date/LefterVTEHC13
Mihai Lefter, George Razvan Voicu, Mottaqiallah Taouil, Marius Enachescu, Said Hamdioui, Sorin Dan Cotofana:
Is TSV-based 3D integration suitable for inter-die memory repair? DATE 2013: 1251-1254

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