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ORCID"3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of ..."
Masahide Goto et al. (2022)
- Masahide Goto, Yuki Honda, Masakazu Nanba, Yoshinori Iguchi, Takuya Saraya, Masaharu Kobayashi, Eiji Higurashi
, Hiroshi Toshiyoshi, Toshiro Hiramoto:
3-Layer stacked pixel-parallel CMOS image sensors using hybrid bonding of SOI wafers. Imaging Sensors and Systems 2022: 1-4
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