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"Modeling and analysis of open defect in through silicon via (TSV) channel."
Daniel H. Jung et al. (2013)
- Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of open defect in through silicon via (TSV) channel. EMC Compo 2013: 163-166
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