"Novel low temperature 3D wafer stacking technology for high density device ..."

Ionut Radu et al. (2013)

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DOI: 10.1109/ESSDERC.2013.6818841

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-30

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Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu:
Novel low temperature 3D wafer stacking technology for high density device integration. ESSDERC 2013: 151-154

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