"Token3D: Reducing Temperature in 3D Die-Stacked CMPs through Cycle-Level ..."

Juan M. Cebrian, Juan L. Aragón, Stefanos Kaxiras (2011)

Details and statistics

DOI: 10.1007/978-3-642-23400-2_28

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-02

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