"Cost Modeling and Analysis of TSV and Contactless 3D-ICs."

Minmin Jiang, Ioannis A. Papistas, Vasilis F. Pavlidis (2020)

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DOI: 10.1145/3386263.3406931

access: closed

type: Conference or Workshop Paper

metadata version: 2021-03-10

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Minmin Jiang, Ioannis A. Papistas, Vasilis F. Pavlidis:
Cost Modeling and Analysis of TSV and Contactless 3D-ICs. ACM Great Lakes Symposium on VLSI 2020: 519-524

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