"Temperature-constrained fixed-outline floorplanning for die-stacking ..."

De-Yu Liu, Wai-Kei Mak, Ting-Chi Wang (2010)

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DOI: 10.1145/1785481.1785580

access: closed

type: Conference or Workshop Paper

metadata version: 2018-11-06

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De-Yu Liu, Wai-Kei Mak, Ting-Chi Wang:
Temperature-constrained fixed-outline floorplanning for die-stacking system-in-package design. ACM Great Lakes Symposium on VLSI 2010: 423-428

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