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"Taping Out Three Class Chips Per Semester in Intel 16 Technology."
Lucy Revina et al. (2025)
- Lucy Revina, Ethan Gao, Ken Ho, Daniel Lovell, Kristofer S. J. Pister, Borivoje Nikolic:

Taping Out Three Class Chips Per Semester in Intel 16 Technology. HCS 2025: 1-53

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