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"A study of Through-Silicon-Via impact on the 3D stacked IC layout."

Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim (2009)

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DOI: 10.1145/1687399.1687524

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/iccad/KimAL09
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  persistent URL:
  - https://dblp.org/rec/conf/iccad/KimAL09
Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim:
A study of Through-Silicon-Via impact on the 3D stacked IC layout. ICCAD 2009: 674-680

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