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"STEAM: a fast compact thermal model for two-phase cooling of integrated ..."

Arvind Sridhar et al. (2013)

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DOI: 10.1109/ICCAD.2013.6691127

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-24

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  dblp key:
  - conf/iccad/SridharMABT13
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  persistent URL:
  - https://dblp.org/rec/conf/iccad/SridharMABT13
Arvind Sridhar, Yassir Madhour, David Atienza, Thomas Brunschwiler, John Richard Thome:
STEAM: a fast compact thermal model for two-phase cooling of integrated circuits. ICCAD 2013: 256-263

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