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"TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted ..."

Dengfeng Wang et al. (2023)

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DOI: 10.1109/ICCAD57390.2023.10323889

access: closed

type: Conference or Workshop Paper

metadata version: 2024-01-04

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Dengfeng Wang, Liukai Xu, Songyuan Liu, Zhi Li, Yiming Chen, Weifeng He, Xueqing Li, Yanan Sun:
TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations. ICCAD 2023: 1-9

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