"Thermal experimental and modeling analysis of high power 3D packages."

Herman Oprins et al. (2015)

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DOI: 10.1109/ICICDT.2015.7165906

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne:
Thermal experimental and modeling analysis of high power 3D packages. ICICDT 2015: 1-4

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