"Achieving Last-Mile Functional Coverage in Testing Chip Design Software ..."

Ming Yan et al. (2023)

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DOI: 10.1109/ICSE-SEIP58684.2023.00037

access: closed

type: Conference or Workshop Paper

metadata version: 2025-03-24

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Ming Yan, Junjie Chen, Hangyu Mao, Jiajun Jiang, Jianye Hao, Xingjian Li, Zhao Tian, Zhichao Chen, Dong Li, Zhangkong Xian, Yanwei Guo, Wulong Liu, Bin Wang, Yuefeng Sun, Yongshun Cui:
Achieving Last-Mile Functional Coverage in Testing Chip Design Software Implementations. ICSE-SEIP 2023: 343-354

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