"Novel Method of Hermetic Sealing of Electronics Package by Electron Beam ..."

Kiran Kumar B. V., Pradyumna J., Abhishek DN (2023)

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DOI: 10.1109/ICST59744.2023.10460770

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type: Conference or Workshop Paper

metadata version: 2024-04-02

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Kiran Kumar B. V., Pradyumna J., Abhishek DN:
Novel Method of Hermetic Sealing of Electronics Package by Electron Beam Welding. ICST 2023: 1-6

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