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"Simulation Analysis of Mechanical Response of Wire Bonding in SiP under ..."

Fangzhou Chen et al. (2020)

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DOI: 10.1109/ICTA50426.2020.9332117

access: closed

type: Conference or Workshop Paper

metadata version: 2024-04-10

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Fangzhou Chen, Si Chen, Bin Zhou, Yun Huang, Fei Qin:
Simulation Analysis of Mechanical Response of Wire Bonding in SiP under Thermal-mechanical-electrical Coupling Load. ICTA 2020: 106-107

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