"Formation Mechanism of high Ni content (Cu, Ni)6Sn5 in Cu/Sn/Ni microbump ..."

Haiyang Yu, C. R. Kao (2022)

> Home

Details and statistics

DOI: 10.1109/ICTA56932.2022.9962977

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-16

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/icta3/YuK22
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/icta3/YuK22
Haiyang Yu, C. R. Kao:
Formation Mechanism of high Ni content (Cu, Ni)6Sn5 in Cu/Sn/Ni microbump for solid state aging. ICTA 2022: 20-21

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.