"Anisotropic conductive film & flip-chip bonding for low-cost sensor ..."

Serguei Stoukatch et al. (2020)

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DOI: 10.1109/SENSORS47125.2020.9278669

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-15

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Serguei Stoukatch, Nicolas André, Thibault P. Delhaye, François Dupont, Jean-Michel Redouté, Denis Flandre:
Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. IEEE SENSORS 2020: 1-4

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