"Detecting Multiclass Defects of Printed Circuit Boards in the ..."

Chun-Hsiang Chang, Hao-Wei Chen, Chun-Cheng Lin (2022)

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DOI: 10.1109/IEEM55944.2022.9989934

access: closed

type: Conference or Workshop Paper

metadata version: 2023-01-05

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Chun-Hsiang Chang, Hao-Wei Chen, Chun-Cheng Lin:
Detecting Multiclass Defects of Printed Circuit Boards in the Molded-interconnect-device Manufacturing Process Using Deep Object Detection Networks. IEEM 2022: 1536-1540

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