"Hole-Side Airgap Integration as Enabler for 3D NAND Flash Z-Pitch Scaling."

S. Rachidi et al. (2025)

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DOI: 10.1109/IMW61990.2025.11026936

access: closed

type: Conference or Workshop Paper

metadata version: 2025-07-24

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S. Rachidi, S. Ramesh, Devin Verreck, J. Loyo, Y. Jeong, H. Puliyalil, Jie Li, F. Seidel, Geert Van Den Bosch, Maarten Rosmeulen:
Hole-Side Airgap Integration as Enabler for 3D NAND Flash Z-Pitch Scaling. IMW 2025: 1-4

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