"Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability."

Mukta G. Farooq et al. (2015)

> Home

Details and statistics

DOI: 10.1109/IRPS.2015.7112732

access: closed

type: Conference or Workshop Paper

metadata version: 2023-09-08

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/FarooqRCPGKCLOL15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/FarooqRCPGKCLOL15
Mukta G. Farooq, Giuseppe La Rosa, Fen Chen, Prakash Periasamy, Troy L. Graves-abe, Chandrasekharan Kothandaraman, C. Collins, W. Landers, J. Oakley, J. Liu, John Safran, S. Ghosh, S. Mittl, D. Ioannou, Carole Graas, Daniel Berger, Subramanian S. Iyer:
Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability. IRPS 2015: 4

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.