BibTeX record conf/irps/JeongKKKLCBKJSP18

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@inproceedings{DBLP:conf/irps/JeongKKKLCBKJSP18,
  author    = {Seongwon Jeong and
               Jinseok Kim and
               Ayoung Kim and
               Byungwook Kim and
               Moonsoo Lee and
               Jaewon Chang and
               In Hak Baick and
               Hanbyul Kang and
               Younggeun Ji and
               Sangchul Shin and
               Sangwoo Pae},
  title     = {Optimal design of dummy ball array in wafer level package to improve
               board level thermal cycle reliability {(BLR)}},
  booktitle = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
               CA, USA, March 11-15, 2018},
  pages     = {3},
  year      = {2018},
  crossref  = {DBLP:conf/irps/2018},
  url       = {https://doi.org/10.1109/IRPS.2018.8353653},
  doi       = {10.1109/IRPS.2018.8353653},
  timestamp = {Wed, 16 Oct 2019 14:14:55 +0200},
  biburl    = {https://dblp.org/rec/conf/irps/JeongKKKLCBKJSP18.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
@proceedings{DBLP:conf/irps/2018,
  title     = {{IEEE} International Reliability Physics Symposium, {IRPS} 2018, Burlingame,
               CA, USA, March 11-15, 2018},
  publisher = {{IEEE}},
  year      = {2018},
  url       = {https://ieeexplore.ieee.org/xpl/conhome/8345372/proceeding},
  isbn      = {978-1-5386-5479-8},
  timestamp = {Mon, 25 Oct 2021 21:27:30 +0200},
  biburl    = {https://dblp.org/rec/conf/irps/2018.bib},
  bibsource = {dblp computer science bibliography, https://dblp.org}
}
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