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"Effects of UBM Thickness and Current Flow Configuration on ..."

Yi Ram Kim et al. (2020)

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DOI: 10.1109/IRPS45951.2020.9129337

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-30

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  dblp key:
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Yi Ram Kim, Allison T. Osmanson, Hossein Madanipour, Choong-Un Kim, Patrick F. Thompson, Qiao Chen:
Effects of UBM Thickness and Current Flow Configuration on Electromigration Failure Mechanisms in Solder Interconnects. IRPS 2020: 1-5

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