"A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL ..."

Y. H. Lin et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10117795

access: closed

type: Conference or Workshop Paper

metadata version: 2023-05-24

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Y. H. Lin, C. C. Lee, C. Y. Liao, M. H. Lin, W. C. Tu, Robin Chen, H. P. Chen, Winston S. Shue, Min Cao:
A Novel Methodology to Predict Process-Induced Warpage in Advanced BEOL Interconnects. IRPS 2023: 1-4

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