"Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k ..."

M. H. Lin, A. S. Oates (2015)

> Home

Details and statistics

DOI: 10.1109/IRPS.2015.7112681

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/LinO15
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/LinO15
M. H. Lin, A. S. Oates:
Mechanisms of electromigration under AC and pulsed-DC stress in Cu/low-k dual damascene interconnects. IRPS 2015: 2

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.