"Silicon Reliability Characterization of Intel's Foveros 3D Integration ..."

Chetan Prasad et al. (2020)

> Home

Details and statistics

DOI: 10.1109/IRPS45951.2020.9129277

access: closed

type: Conference or Workshop Paper

metadata version: 2022-01-07

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/irps/PrasadCGHKLMNOP20
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/irps/PrasadCGHKLMNOP20
Chetan Prasad, Sunny Chugh, Hannes Greve, I-chen Ho, Enamul Kabir, Cheyun Lin, Mahjabin Maksud, Steven R. Novak, Benjamin Orr, Keun Woo Park, Anthony Schmitz, Zhizheng Zhang, Peng Bai, Doug B. Ingerly, Emre Armagan, Hsinwei Wu, Patrick N. Stover, Lance Hibbeler, Michael O'Day, Daniel Pantuso:
Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. IRPS 2020: 1-5

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.