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"Impact of via geometry and line extension on via-electromigration in ..."

A. S. Saleh et al. (2023)

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DOI: 10.1109/IRPS48203.2023.10118027

access: closed

type: Conference or Workshop Paper

metadata version: 2023-06-26

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  dblp key:
  - conf/irps/SalehZCWC23
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  - https://dblp.org/rec/conf/irps/SalehZCWC23
A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes:
Impact of via geometry and line extension on via-electromigration in nano-interconnects. IRPS 2023: 1-4

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