"Wafer-level electromigration for reliability monitoring: Quick-turn ..."

D. Slottke et al. (2015)

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DOI: 10.1109/IRPS.2015.7112806

access: closed

type: Conference or Workshop Paper

metadata version: 2023-08-31

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D. Slottke, R. J. Kamaladasa, M. Harmes, Ilan Tsameret, Mauro J. Kobrinsky, Timothy McMullen, John Dunklee:
Wafer-level electromigration for reliability monitoring: Quick-turn electromigration stress with correlation to package-level stress. IRPS 2015: 3

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