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"Thermal Challenges for HPC 3DFabric^TM Packages and Systems."

Kathy Wei Yan, Po-Yao Lin, Sheng-Liang Kuo (2022)

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DOI: 10.1109/IRPS48227.2022.9764572

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  dblp key:
  - conf/irps/YanLK22
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  - https://dblp.org/rec/conf/irps/YanLK22
Kathy Wei Yan, Po-Yao Lin, Sheng-Liang Kuo:
Thermal Challenges for HPC 3DFabric^TM Packages and Systems. IRPS 2022: 4

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