"Integration of Thermal Inkjet into Over-Molded Substrates for Lab-on-CMOS ..."

Jacob Dawes et al. (2025)

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DOI: 10.1109/ISCAS56072.2025.11043309

access: closed

type: Conference or Workshop Paper

metadata version: 2025-07-08

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Jacob Dawes, Alyssa Estenson, Louis Marun, George Corrigan, Alexander Govyadinov, Anand Jebakumar, Pavel Kornilovich, Erik Torniainen, Matthew L. Johnston:
Integration of Thermal Inkjet into Over-Molded Substrates for Lab-on-CMOS Pumping Applications. ISCAS 2025: 1-5

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