"3D SRAM Disaggregation in Advanced CMOS Nodes using Hybrid Bonding Technology."

Bhawana Kumari et al. (2025)

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DOI: 10.1109/ISCAS56072.2025.11043974

access: closed

type: Conference or Workshop Paper

metadata version: 2025-08-05

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Bhawana Kumari, Anurag Swarnkar, Dawit Burusie Abdi, Fernando García-Redondo, James Myers, Julien Ryckaert, Jaydeep Kulkarni, Dwaipayan Biswas:
3D SRAM Disaggregation in Advanced CMOS Nodes using Hybrid Bonding Technology. ISCAS 2025: 1-5

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